Semiconductor devices  and methods of manufacturing semiconductor devices

ABSTRACT

In one example, a semiconductor device comprises a spacer substrate, a first lens substrate over the first spacer substrate, and a lens protector over the first lens dielectric adjacent to the first lens. The spacer substrate comprises a spacer dielectric, a spacer top terminal, a spacer bottom terminal, and a spacer via. The first lens substrate comprises a first lens dielectric, a first lens, a first lens top terminal, a first lens bottom terminal, and a first lens via. A first interconnect is coupled with the spacer top terminal and the first lens bottom terminal. Other examples and related methods are also disclosed herein.

TECHNICAL FIELD

The present disclosure relates, in general, to electronic devices, andmore particularly, to semiconductor devices and methods formanufacturing semiconductor devices.

BACKGROUND

Prior semiconductor packages and methods for forming semiconductorpackages are inadequate, for example resulting in excess cost, decreasedreliability, relatively low performance, or package sizes that are toolarge. Further limitations and disadvantages of conventional andtraditional approaches will become apparent to one of skill in the art,through comparison of such approaches with the present disclosure andreference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-sectional view of an example semiconductor device.

FIGS. 2A to 2M show cross-sectional views of an example method formanufacturing an example semiconductor device.

FIG. 3 shows a cross-sectional view of an example semiconductor device.

The following discussion provides various examples of semiconductordevices and methods of manufacturing semiconductor devices. Suchexamples are non-limiting, and the scope of the appended claims shouldnot be limited to the particular examples disclosed. In the followingdiscussion, the terms “example” and “e.g.” are non-limiting.

The figures illustrate the general manner of construction, anddescriptions and details of well-known features and techniques may beomitted to avoid unnecessarily obscuring the present disclosure. Inaddition, elements in the drawing figures are not necessarily drawn toscale. For example, the dimensions of some of the elements in thefigures may be exaggerated relative to other elements to help improveunderstanding of the examples discussed in the present disclosure. Thesame reference numerals in different figures denote the same elements.

The term “or” means any one or more of the items in the list joined by“or”. As an example, “x or y” means any element of the three-element set{(x), (y), (x, y)}. As another example, “x, y, or z” means any elementof the seven-element set {(x), (y), (z), (x, y), (x, z), z), (x, y, z)}.

The terms “comprises,” “comprising,” “includes,” and/or “including,” are“open ended” terms and specify the presence of stated features, but donot preclude the presence or addition of one or more other features. Theterms “first,” “second,” etc. may be used herein to describe variouselements, and these elements should not be limited by these terms. Theseterms are only used to distinguish one element from another. Thus, forexample, a first element discussed in this disclosure could be termed asecond element without departing from the teachings of the presentdisclosure.

Unless specified otherwise, the term “coupled” may be used to describetwo elements directly contacting each other or describe two elementsindirectly connected by one or more other elements. For example, ifelement A is coupled to element B, then element A can be directlycontacting element B or indirectly connected to element B by anintervening element C. Similarly, the terms “over” or “on” may be usedto describe two elements directly contacting each other or describe twoelements indirectly connected by one or more other elements.

DESCRIPTION

In one example, a semiconductor device comprises a spacer substratecomprising, a spacer dielectric, a spacer top terminal on a top side ofthe spacer substrate, a spacer bottom terminal on a bottom side of thespacer substrate, and a spacer via in the spacer dielectric and coupledwith the spacer top terminal and the spacer bottom terminal. Thesemiconductor device also comprises a first lens substrate over thefirst spacer substrate, the first lens substrate comprising, a firstlens dielectric, a first lens, a first lens top terminal on a top sideof the first lens dielectric, a first lens bottom terminal on a bottomside of the first lens dielectric, and a first lens via in in the firstlens dielectric and coupled with the first lens top terminal and thefirst lens bottom terminal. In addition, the semiconductor devicecomprises a lens protector over the first lens dielectric adjacent tothe first lens; and a first interconnect coupled with the spacer topterminal and the first lens bottom terminal.

In another example, a semiconductor device, comprises a first lenssubstrate, comprising a first lens dielectric, a first lens over thefirst lens dielectric, and a lens top terminal on a top side of thefirst lens dielectric. The semiconductor device also comprises a spacersubstrate over the first lens substrate, the spacer substrate comprisinga spacer dielectric, a spacer top terminal, and a spacer bottomterminal. The semiconductor device also comprises a second lenssubstrate over the spacer substrate, the second lens substratecomprising a second lens dielectric, a second lens over the second lensdielectric, and a lens bottom terminal on a bottom side of the secondlens dielectric. In addition, the semiconductor device comprises a firstinterconnect coupled with the lens top terminal and the spacer bottomterminal and a second interconnect coupled with the spacer top terminaland the lens bottom terminal, wherein the first lens has a first opticalcharacteristic and the second lens has a second optical characteristicdifferent than the first optical characteristic.

In a further example, a method to manufacture a semiconductor devicecomprising providing a first lens substrate having a first lens,providing a first spacer substrate facing the first lens substrate, andcoupling the first lens substrate and the first spacer substrate with afirst interconnect. The first lens substrate comprises a first lens viaand a first lens terminal coupled to the first lens via, the firstspacer substrate comprises a first spacer via and a first spacerterminal coupled to the first spacer via, and the first interconnectcouples the first lens terminal with the first spacer terminal.

Other examples are included in the present disclosure. Such examples maybe found in the figures, in the claims, or in the description of thepresent disclosure.

FIG. 1 shows a cross-sectional view of an example semiconductor device1000. In the example shown in FIG. 1, semiconductor device 1000 cancomprise lens unit 100 and base unit 200. Lens unit 100 can compriselens substrates 110, 130, or 150, spacer substrates 120 or 140, lensprotector 160, encapsulant 170, or underfill 180.

Lens substrates 110, 130, or 150 can comprise dielectrics 111, 131, or151 and self-alignment features such as vias 112, 132, or 152, lens topterminals 113, 133, or 153, lens bottom terminals 114, 134, or 154, orinterconnects 115, 135, or 155. Dielectrics 111, 131, or 151 cancomprise or be coupled with lenses 111 a, 131 a, or 151 a. Spacerstructures 120 or 140 can comprise dielectric walls 121 or 141, andself-alignment features such as vias 122 or 142, spacer top terminals123 or 143, spacer bottom terminals 124 or 144, or interconnects 125 or145. In some examples, spacer substrates 120 or 140 can comprise aspacer dielectric 121 or 141, a spacer top terminal 123 or 143 on a topside of the spacer substrate 120 or 140, a spacer bottom terminal 124 or144 on a bottom side of the spacer substrate 120 or 140, and a spacervia 122 or 142 in the spacer dielectric 121 or 141 and coupled with thespacer top terminal 123 or 143 and the spacer bottom terminal 124 or144.

The provision of self-alignment features can permit automatic alignmentof lenses 111 a, 131 a, or 151 a with each other when lens substrates110, 130, or 150 and spacer structures 120 or 140 are coupled to eachother through such self-alignment features. In some examples, theself-alignment features do not conduct electric signals through orwithin lens unit 100. In some examples, lens substrate 110, 130, or 150can be over or can face spacer substrate 120 or 140. Lens substrate 110,130, or 150 can comprise lens dielectric 111, 131, or 151, lens 111 a,131 a, or 151 a, lens top terminal 113, 133, or 153 on a top side oflens dielectric 111, 131, or 151, and lens via 112, 132, or 152 in lensdielectric 111, 131, or 151 and coupled with lens top terminal 113, 133,or 153 and with lens bottom terminals 114, 134, or 154.

Base unit 200 can comprise base substrate 210, electronic component 220,interface element 223, encapsulant 230, lid 260, base bottom terminals270, and self-alignment features such as vertical interconnects 240 orbase top terminals 250 on a top side of encapsulant 230. In someexamples, via or vertical interconnect 240 can couple with base topterminal 250 on a top side of encapsulant 230. Lens substrate 110, 130,or 150 can be over base substrate 210. Base substrate 210 can comprisedielectric structure 211 having one or more dielectric layers, andconductive structure 212 having one or more conductive layers.Encapsulant 230 can be over dielectric structure 211 and can contact aside of electronic component 220. Electronic component 220 can compriseterminals 221 and interface element 223. Internal interconnects 222 cancouple electronic component 220 with conductive structure 212 of basesubstrate 210.

The provision of self-alignment features can permit automatic alignmentof lenses 111 a, 131 a, or 151 a with lid 260 or with interface element223 when lens unit 100 and base unit 200 are coupled together throughsuch self-alignment features. In some examples, the self-alignmentfeatures do not conduct electric signals between lens unit 100 and baseunit 200.

Base substrate 210, encapsulant 230, vertical interconnects 240, basetop terminals 250, lid 260, and base bottom terminals 270 of base unit200 can comprise or be referred to as a semiconductor package, and whencombined with lens unit 100, can be referred to as semiconductor package1001 or package 1001. Package 1001 can provide protection for electroniccomponent 220 from external elements or environmental exposure.Semiconductor package 1001 can provide electrical couplings between anexternal component and electronic component 220.

FIGS. 2A to 2M show cross-sectional views of an example method formanufacturing an example semiconductor device. FIG. 2A shows across-sectional view of semiconductor device 1000 at an early stage ofmanufacture. In the example shown in FIG. 2A, bottom side 110 y of lenssubstrate 110 can be attached to carrier 10. Although one lens substrate110 attached to carrier 10 is shown, multiple lens substrates 110 can bearranged and attached on carrier 10 to be spaced apart from one anotherin a row-wise direction or in a column-wise direction.

Lens substrate 110 can comprise dielectric 111, vias 112, lens topterminals 113, lens bottom terminals 114, and interconnects 115. Topside and bottom side of dielectric 111 can be along top side 110 x orbottom side 110 y of lens substrate 110, respectively. Lens 111 a can bepositioned roughly at the center of top side 110 x or bottom side 110 yof dielectric 111. Lens 111 a can upwardly protrude or can be downwardlyrecessed into dielectric 111. Lens 111 a can be monolithic with lenssubstrate 110 or can be formed or coupled on lens substrate 110. In someexamples, lens 111 a and dielectric 111 can be monolithic or cancomprise a same material. In some examples, lens 111 a and dielectric111 can be distinct from each other or can comprise different materials.Dielectric 111 can be a panel having substantially planar top side 110 xand bottom side 110 y at the exterior edges of lens 111 a. Dielectric111 can comprise or be referred to as glass, silicon, plastic, or atransparent material. Dielectric 111 can have a width in the range ofabout 1 millimeter (mm) to about 1,000 mm, or a thickness in the rangeof about 1 micrometer (μm) to about 100 μm. Dielectric 111 can be a corelayer allowing lens substrate 110 to be maintained at a substantiallyplanar state.

Vias 112 can be exposed at top and bottom sides 110 x and 110 y ofdielectric 111 to couple lens top terminals 113 with lens bottomterminals 114. In some examples, vias 112 can comprise or be referred toas through glass vias (TGVs), through silicon vias (TSVs), conductivevias, or conductive posts. In some examples, vias 112 can comprise ametallic material, such as copper, iron, nickel, gold, silver,palladium, or tin. In some examples, vias 112 can comprise an insulatingmaterial, such as a plug material. In some examples, vias 112 can have athickness in the range of about 1 μm to about 100 mm.

Lens top terminals 113 can be provided on top side 110 x of dielectric111, and lens bottom terminals 114 can be provided on bottom side 110 yof dielectric 111. Lens top terminals 113 and lens bottom terminals 114can be provided in a matrix configuration having rows or columns. Insome examples, lens top terminals 113 and lens bottom terminals 114 cancomprise or be referred to as conductive lands, conductive pads, wiringpads, or micropads. In some examples, lens top terminals 113 and lensbottom terminals 114 can comprise copper, iron, nickel, gold, silver,palladium, or tin. In some examples, lens top terminals 113 or lensbottom terminals 114 can have a thickness, a width, or a space rangingof about 1 μm to about 100 mm.

Interconnects 115 can be coupled to bottom sides of lens bottomterminals 114. Interconnects 115 can comprise tin (Sn), silver (Ag),lead (Pb), copper (Cu), Sn—Pb, Sn37-Pb, Sn95-Pb, Sn—Pb—Ag, Sn—Cu, Sn—Ag,Sn—Au, Sn—Bi, or Sn—Ag—Cu. For example, interconnects 115 can beprovided by a solder-containing conductive material to bottom sides oflens bottom terminals 114 through a ball-drop process, followed byperforming a reflow process. Interconnects 115 can comprise or bereferred to as conductive balls such as solder balls, conductive pillarssuch as copper pillars, or conductive posts having solder caps on copperpillars. Interconnects 115 can have a diameter in the range of about 1μm to about 10 mm.

Carrier 10 can be substantially planar. In some examples, carrier 10 cancomprise or be referred to as board, a wafer, a panel, a semiconductor,or a strip. In some examples, carrier 10 can comprise steel, stainlesssteel, aluminum, copper, ceramic, glass, or a wafer. Carrier 10 can havea width in the range of about 10 mm to about 10,000 mm and a thicknessin the range of about 1 mm to about 1,000 mm. Carrier 10 can function tointegrally handle multiple components during attachment of lenssubstrate 110, placement of spacer substrates 120 and 140, placement oflens substrates 130 and 150 and attachment of lens protector 160.Carrier 10 can be commonly applied to some examples of the presentdisclosure.

Temporary bond film 11 can be provided on a side of carrier 10.Temporary bond film 11 can be bonded to bottom side 110 y of dielectric111 to cover lens bottom terminals 114 and interconnects 115. Temporarybond film 11 can be brought into contact with bottom side 110 y ofdielectric 111, lens bottom terminals 114, and interconnects 115.Temporary bond film 11 can comprise a thermally releasable tape or filmor a photo-releasable tape or film, where adhesiveness can be weakenedor removed by heat or light. In some examples, the adhesiveness oftemporary bond film 11 can be weakened or removed by physical orchemical external force. The thickness of temporary bond film 11 canrange of about 1 μm to about 10 mm. Temporary bond film 11 can permitcarrier 10 to be separated at a later stage. Temporary bond film 11 canbe commonly applied to some examples of the present disclosure.

FIG. 2B shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2B,interconnects 125 of spacer substrate 120 can be coupled to lens topterminals 113 of lens substrate 110 to couple lens substrate 110 withspacer substrate 120. Spacer substrate 120 can comprise dielectric wall121, vias 122, spacer top terminals 123, spacer bottom terminals 124,interconnects 125, and spacer cavity 126. Spacer cavity 126 canpenetrate top side 120 x and bottom side 120 y of spacer substrate 120.Spacer cavity 126 can be provided at central portion of spacer substrate120. Dielectric wall 121 of spacer substrate 120 can define a ringshape, such as a circular ring or rectangular ring. Lens 111 a of lenssubstrate 110 can be exposed through spacer cavity 126 of spacersubstrate 120. Spacer substrate 120 can adjust a distance between, forexample, lens substrate 110 and lens substrate 130. In some examples,spacer substrate 120 can have a thickness in the range of about 1 μm toabout 100 mm.

In some examples, spacer substrate 120 can comprise or be referred to asa laminate substrate, a pre-formed substrate, a printed circuit board, acavity substrate printed wiring board, a single-layered or multi-layeredsubstrate, a through hole substrate, a glass epoxy substrate, apolyimide substrate, a polyester substrate, a molded plastic substrate,or a ceramic substrate.

In some examples, dielectric wall 121 can have substantially planar topand bottom sides. The top and bottom sides of dielectric wall 121 can bealong top and bottom sides 120 x and 120 y of spacer substrate 120,respectively. In some examples, spacer cavity 126 penetrating top side120 x and bottom sides 120 y of spacer substrate 120 can be provided ata central portion of dielectric wall 121. Dielectric wall 121 cancomprise or be referred to as one or more dielectric layers. In someexamples, one or more of such dielectric layers can comprise or bereferred to as a core layer, such as a fiber-reinforced core layer. Insome examples, dielectric wall 121 can comprise an epoxy resin, a phenolresin, fiberglass-reinforced epoxy, polyimide, polyester, an epoxymolding compound, or a ceramic. Dielectric wall 121 can allow spacersubstrate 120 to be maintained at a substantially planar state.

Vias 122 can be exposed at top side 120 x and bottom side 120 y ofdielectric wall 121 to couple spacer top terminals 123 to spacer bottomterminals 124. In some examples, vias 122 can comprise or be referred toas conductive vias or conductive posts. In some examples, vias 122 cancomprise vertical wires extending through dielectric wall 121. In someexamples, vias 122 can be similar to vias 112 with respect tocorresponding features, elements, materials, or formation.

Spacer top terminals 123 can be provided on top side 120 x of dielectricwall 121, and spacer bottom terminals 124 can be provided to bottom side120 y of dielectric wall 121. Spacer top terminals 123 can comprise orbe referred to as pads, under-bump-metallurgies (UBMs), or top sides ofvias 122. Spacer bottom terminals 124 can comprise or be referred to aspads, UBMs, or bottom sides of vias 122. In some examples, spacer topterminals 123 or spacer bottom terminals 124 can be similar to lens topterminals 113 or lens bottom terminals 114 with respect to correspondingfeatures, elements, materials, or formation.

Interconnects 125 can be coupled to bottom sides of spacer bottomterminals 124. In some examples, interconnects 125 can be similar tointerconnects 115 with respect to corresponding features, elements,materials, or formation.

In some examples, spacer substrate 120 can be picked up bypick-and-place equipment and then be placed on a top side of lenssubstrate 110. Next, interconnects 125 of spacer substrate 120 can beconnected to lens top terminals 113 of lens substrate 110 using a massreflow process, a thermal compression process, or a laser assistedbonding process. Spacer substrate 120 can be automatically aligned onlens substrate 110 while interconnects 125 are connected to lens topterminals 113.

FIG. 2C shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2C, underfill127 can be provided between lens substrate 110 and spacer substrate 120.In some examples, underfill 127 can be injected or absorbed into the gapbetween top side 110 x of lens substrate 110 and bottom side 120 y ofspacer substrate 120 by a capillary action and can then be cured. Insome examples, underfill 127 can first be dispensed to cover lens topterminals 113 of lens substrate 110, and interconnects 125 of spacersubstrate 120 can then penetrate underfill 127 to be coupled to lens topterminals 113. In some examples, underfill 127 can comprise or bereferred to as an adhesive, a dielectric, or a nonconductive paste. Insome examples, underfill 127 can comprise a filler-free resin. Underfill127 can prevent spacer substrate 120 from being electricallydisconnected from lens substrate 110 due to physical or chemical shocks.

FIG. 2D shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2D,interconnects 135 of lens substrate 130 can be coupled to spacer topterminals 123 of spacer substrate 120. Lens substrate 130 can be pickedup by pick-and-place equipment in a state where carrier 20 is attachedto top side 130 x of lens substrate 130, and then be placed on or overtop side 120 x of spacer substrate 120. In some examples, interconnects135 of lens substrate 130 can be connected to spacer top terminals 123of spacer substrate 120 using a mass reflow process, a thermalcompression process, or a laser assisted bonding process. Lens substrate130 can be automatically aligned on spacer substrate 130 whileinterconnects 135 are connected to spacer top terminals 123.

Lens substrate 130 can comprise dielectric 131, vias 132, lens topterminals 133, lens bottom terminals 134, and interconnects 135.Dielectric 131 can comprise or be coupled with lens 131 a. In someexamples, lens substrate 130 or lens 131 a can be similar to lenssubstrate 110 or lens 111 a with respect to corresponding features,elements, materials, or formation. Optical characteristics of lens 131a, such as magnification, filtering, or focal length, can be the same ordifferent than optical characteristics of lens 111 a. In some examples,lens substrate 130 can be over spacer substrate 120, and spacersubstrate 120 can be over lens substrate 110 to provide lens 131 a overand aligned with lens 111 a.

Carrier 20 can comprise temporary bond film 21 provided on its bottomside. Carrier 20 can be attached to top side 130 x of lens substrate 130by temporary bond film 21. Carrier 20 functions to handle lens substrate130. Carrier 20 can be commonly applied to some examples of the presentdisclosure. Carrier 20 or temporary bond film 21 can be similar tocarrier 10 or temporary bond film 11 with respect to correspondingfeatures, elements, materials, or formation.

FIG. 2E shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2E, underfill137 can be provided between spacer substrate 120 and lens substrate 130.In some examples, underfill 137 can be injected or absorbed into a gapbetween top side 120 x of spacer substrate 120 and bottom side 130 y oflens substrate 130 by a capillary action and can then be cured.Underfill 137 can be similar to underfill 127.

FIG. 2F shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2F, carrier 20can be removed from top side 130 x of lens substrate 130. Temporary bondfilm 21 can be separated from lens substrate 130 while remainingattached to carrier 20. In some examples, adhesiveness of temporary bondfilm 21 can be removed or weakened by heat, light, a chemical solution,or physical external force. Accordingly, top side 130 x of lenssubstrate 130 can be exposed.

FIG. 2G shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2G,interconnects 145 of spacer substrate 140 can be coupled with lens topterminals 133 of lens substrate 130. Spacer substrate 140 can comprisedielectric wall 141, vias 142, spacer top terminals 143, spacer bottomterminals 144, interconnects 145, spacer cavity 146, and underfill 147.Spacer substrate 140 can expose lens 131 a of lens substrate 130 throughspacer cavity 146.

Spacer substrate 140 can be similar to spacer substrate 120 with respectto corresponding features, elements, materials, or formation. Theprocess of connecting interconnects 145 to lens top terminals 133 can besimilar to the process of connecting interconnects 125 to lens topterminals 113 shown in FIG. 2B. Underfill 147 can be similar asunderfill 127 shown in FIG. 2C.

FIG. 2H shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2H,interconnect 155 of lens substrate 150 can be coupled to spacer topterminal 143 of spacer substrate 140. Lens substrate 150 can comprisedielectric 151, vias 152, lens top terminals 153, lens bottom terminals154, and interconnects 155. Dielectric 151 can comprise or be coupledwith lens 151 a. In some examples, interconnect 135 or 155 can couplespacer top terminal 123 or 143 with lens bottom terminal 134 or 154. Insome examples, lens substrate 150 or lens 151 a can be similar to lenssubstrate 110 or lens 111 a with respect to corresponding features,elements, materials, or formation. Optical characteristics of lens 151a, such as magnification, filtering, or focal length, can be the same ordifferent than optical characteristics of lens 111 a or lens 131 a.

FIG. 2I shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2I, lensprotector 160 can be attached to lens substrate 150. In some examples,lens protector 160 can be over lens dielectric 111, 131, or 151 adjacentto lens 111 a, 131 a, or 151 a.

Lens protector 160 can comprise lens cavity 162. Lens cavity 162 can beexposed at top side 160 x and bottom side 160 y of lens protector 160.In some examples, lens cavity 162 can be provided at a central portionof lens protector 160. Lens protector 160 can define a ring shape suchas a circular ring or a rectangular ring. Lens protector 160 can exposelens 151 a through lens cavity 162. Lens cavity 162 can have a widthsimilar to spacer cavity 126.

In some examples, lens protector 160 can be picked up by pick-and-placeequipment and then placed on a side of adhesive 161 provided to top side150 x of lens substrate 150. Bottom side 160 y of lens protector 160 canbe adhered to top side 150 x of lens substrate 150 by adhesive 161. Insome examples, lens protector 160 can have a thickness in the range ofabout 100 μm to about 100 mm. Lens protector 160 can prevent lens 151 afrom upwardly protruding to protect the top or sides of lens 151 a. Insome examples, adhesive 161 can comprise or be referred to as an epoxymaterial, a metallic material, or a KOVAR alloy. In some examples,adhesive 161 can be similar to underfill 127.

In some examples, lens protector 160 can be made of an electricallyinsulating material such as a polymer, or a conductive material such asa metal. Lens protector 160 can comprise or be referred to as a lensprotection structure or a lens protection layer. In some examples, lensprotector 160 can be similar to spacer substrate 120 or spacer substrate140. For instance, lens protector 160 can comprise a dielectric wallsimilar to dielectric wall 121 or dielectric wall 141 of spacersubstrates 120 or 140, though need not comprise vias like vias 122 or142.

FIG. 2J shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2J, carrier 10can be removed from bottoms side 110 y of lens substrate 110.Accordingly, bottom side 110 y of lens substrate 110 and interconnects115 can be exposed. In some examples, carrier 10 can be similarlyremoved as described with respect to carrier 20.

FIG. 2K shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2K, encapsulant170 can be provided to cover lens protector 160, lens substrates 110,130, or 150, and spacer substrates 120 or 140. In some examples,encapsulant 170 can be brought into contact with top side 160 x andlateral sides of lens protector 160. In some examples, encapsulant 170can be brought into contact with lateral sides of lens substrates 110,130, or 150 and external lateral sides of spacer substrates 120 or 140.In some examples, encapsulant 170 can be brought into contact withlateral sides of adhesive 161 and lateral sides of underfills 127, 137,147, or 157. Lens 151 a can remain exposed from encapsulant 170. In someexamples, encapsulant 170 can contact a lateral side of lens substrate110, 130, or 150 and a dielectric wall 121 or 141 of spacer substrate120 or 140. In some examples, encapsulant 170 can be provided over alateral side of lens substrate 150 and over a dielectric wall 141 ofspacer substrate 140 or a dielectric wall 121 of spacer substrate 120.

In some examples, encapsulant 170 can comprise or be referred to asepoxy molding compound, epoxy molding resin, or dielectric encapsulant.In some examples, encapsulant 170 can be made of an opaque material. Insome examples encapsulant 170 can comprise an organic resin, aninorganic filler, a curing agent, a catalyst, a coupling agent, acoloring agent, or a flame retardant. In some examples, encapsulant 170can be provided by a compression molding process, a transfer moldingprocess, a liquid phase encapsulant molding process, a vacuum laminationprocess, a paste printing process, or a film assisted molding process.Encapsulant 170 can have a thickness in the range of about 10 μm toabout 100 mm. Encapsulant 170 can be provided to cover lens protector160, lens substrates 110, 130, or 150 and spacer substrates 120 or 140,to protect lens protector 160, lens substrates 110, 130, or 150 andspacer substrates 120 or 140 from external elements or environmentalexposure.

Encapsulant 170 can be provided to define lens unit 100. Lens unit 100can comprise lens substrates 110, 130, or 150, spacer substrates 120 or140, lens protector 160, and encapsulant 170. Lens unit 100 can bemanufactured by the manufacturing method shown in FIGS. 2A to 2K.

FIG. 2L shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2L,interconnects 115 of lens unit 100 can be coupled to base top terminals250 of base unit 200 and can couple base unit 200 with lens substrate110. Lens unit 100 can be stacked on base unit 200.

In some examples, lens unit 100 can be picked up by pick-and-placeequipment and then be placed on base top terminals 250 of base unit 200.Next, lens unit 100 can be connected to base unit 200 using a massreflow process, a thermal compression process, or a laser assistedbonding process. Lens unit 100 can be automatically aligned on base unit200 while interconnects 115 are connected to base top terminals 250.Accordingly, electronic component 220 can be aligned with lens 111 a.Because interconnects 115 can couple lens unit 100 to base unit 200,interconnects 115 can be referred as base interconnects. Base unit 200can comprise base substrate 210, electronic component 220, encapsulant230, vertical interconnects 240, base top terminals 250, lid 260, orbase bottom terminals 270.

Base substrate 210 can comprise dielectric structure 211 having one ormore dielectric layers, and conductive structure 212 having multipleconductive paths, layers, or patterns on or through the one or moredielectric layers of dielectric structure 211. The top side and bottomside of dielectric structure 211 can be along top side 210 x or bottomside 210 y of base substrate 210. Conductive structure 212 can compriseconductive paths 212 a between top side 210 x and bottom side 210 y,with conductive pads 212 b and 212 c provided at top side 210 x orbottom side 210 y of base substrate 210. In some examples, interconnect115 can be coupled with lens bottom terminal 114 and encapsulant topterminal 250. In some examples, lid 260 can be over electronic component220, or between electronic component 220 and lens 111 a. In someexamples, lens substrate 110, 130, or 150, or lens 111 a, 131 a, or 151a, can be over base unit 200. Base unit 200 can comprise aredistribution layer (RDL) base substrate 210, or can comprise apre-formed base substrate 210.

In some examples, dielectric structure 211 can comprise or be referredto as one or more dielectric, solder mask, core, or prepreg layers. Insome examples, dielectric structure 211 can comprise an epoxy resin, aphenol resin, glass epoxy, polyimide, polyester, an epoxy moldingcompound, or a ceramic.

In some examples, conductive structure 212 can comprise or be referredto as one or more conductive layers, traces, pads, terminals, UBMs, orvias. In some examples conductive structure 212 can comprise copper,iron, nickel, gold, silver, palladium, or tin.

In some examples base substrate 210 can comprise or be referred to as aprinted circuit board, a cavity substrate, multi-layered substrate, athrough hole substrate, a rigid substrate, a flexible substrate, a glassepoxy substrate, a polyimide substrate, a polyester substrate, a moldedsubstrate, a ceramic substrate, an etched foil process substrate, anadditive process substrate, a buildup substrate, or a pre-molded leadframe. In some examples, base substrate 210 can have a thickness in therange of about 1 μm to about 100 mm.

In some examples, base substrate 210 can comprise a redistribution layer(“RDL”) substrate. RDL substrates can comprise one or more conductiveredistribution layers and one or more dielectrics that (a) can be formedlayer by layer over an electronic device where the RDL substrate is tobe electrically coupled, or (b) can be formed layer by layer over acarrier and can be entirely removed or at least partially removed afterthe electronic device and the RDL substrate are coupled together. RDLsubstrates can be manufactured layer by layer as a wafer-level substrateon a round wafer in a wafer-level process, or as a panel-level substrateon a rectangular or square panel carrier in a panel-level process. RDLsubstrates can be formed in an additive buildup process and can includeone or more dielectrics alternatingly stacked with one or moreconductive layers and define respective conductive redistributionpatterns or traces configured to collectively (a) fan-out electricaltraces outside the footprint of the electronic device, or (b) fan-inelectrical traces within the footprint of the electronic device. Theconductive patterns can be formed using a plating process such as, forexample, an electroplating process, or an electroless plating process.The conductive patterns can comprise an electrically conductivematerial, for example copper or other plateable metal. The locations ofthe conductive patterns can be made using a photo-patterning processsuch as a photolithography process and a photoresist material to form aphotolithographic mask. The dielectrics of the RDL substrate can bepatterned with a photo-patterning process and can include aphotolithographic mask through where light is exposed to photo-patterndesired features such as vias in the dielectrics. The dielectrics can bemade from photo-definable organic dielectric materials, for examplepolyimide (PI), benzocyclobutene (BCB), or polybenzoxazole (PBO). Suchdielectric materials can be spun-on or otherwise coated in liquid form,rather than attached as a pre-formed film. To permit proper formation ofdesired photo-defined features, such photo-definable dielectricmaterials can omit structural reinforcers or can be filler-free, withoutstrands, weaves, or other particles, where it could interfere with thelight from the photo-patterning process. In some examples, suchfiller-free characteristics of filler-free dielectric materials canpermit a reduction of the thickness of the resulting dielectric.Although the photo-definable dielectric materials described above can beorganic materials, in other examples the dielectric materials of the RDLsubstrates can comprise one or more inorganic dielectrics. Some examplesof one or more inorganic dielectrics can comprise silicon nitride(Si3N4), silicon oxide (SiO2), or silicon oxynitride (SiON). Theinorganic dielectric or dielectrics can be formed by growing theinorganic dielectrics using an oxidation or nitridization processinstead using photo-defined organic dielectric materials. Such inorganicdielectrics can be filler-fee, without strands, weaves, or otherdissimilar inorganic particles. In some examples, the RDL substrates canomit a permanent core structure or carrier, for example a dielectricmaterial comprising bismaleimide triazine (BT) or FR4, and these typesof RDL substrates can be referred to as a coreless substrate. Othersubstrates in this disclosure can also comprise an RDL substrate.

In some examples, base substrate 210 can be a pre-formed substrate. Thepre-formed substrate can be manufactured prior to attachment to anelectronic device and can comprise dielectrics between respectiveconductive layers. The conductive layers can comprise copper and can beformed using an electroplating process. The dielectrics can berelatively thicker non-photo-definable layers and can be attached as apre-formed film rather than as a liquid and can include a resin withfillers such as strands, weaves, or other inorganic particles forrigidity or structural support. Since the dielectrics arenon-photo-definable, features such as vias or openings can be formed byusing a drill or laser. In some examples, the dielectrics can comprise aprepreg material or Ajinomoto Buildup Film (ABF). The pre-formedsubstrate can include a permanent core structure or carrier such as, forexample, a dielectric material comprising bismaleimide triazine (BT) orFR4, and dielectric and conductive layers can be formed on the permanentcore structure. In other examples, the pre-formed substrate can be acoreless substrate and omits the permanent core structure, and thedielectric and conductive layers can be formed on a sacrificial carrierand is removed after formation of the dielectric and conductive layersand before attachment to the electronic device. The pre-formed substratecan rereferred to as a printed circuit board (PCB) or a laminatesubstrate. Such pre-formed substrate can be formed through asemi-additive or modified-semi-additive process. Other substrates inthis disclosure can also comprise a pre-formed substrate.

Electronic component 220 can have a bottom side bonded to top side 210 xof base substrate 210 using an adhesive, and terminals 221 provided attop side of electronic component 220 and coupled to conductive pads 212b at top side 210 x of base substrate 210 through internal interconnects222. The top side of electronic component 220 can comprise interfaceelement 223 electrically coupled to terminals 221. In some examples,interface element 223 can comprise or be referred to as an opticalsensor or an optical emitter. In some examples, interface element 223 ofelectronic component 220 can sense or emit radiation, such as light,whether visible or invisible, through lid 260 and lenses 111 a, 131 a,and 151 a of lens unit 100.

Terminals 221 of electronic component 220 can be input/output terminalsof electronic component 220. Although terminals 221 are shown facingupward in a wire bonded configuration, in some examples terminals 221can face downward in a flip-chip configuration. In some examples,terminals 221 can comprise or be referred to as die pads, bond pads, orbumps. In some examples, internal interconnects 222 of electroniccomponent 220 can comprise or be referred to as wires or bumps. In someexamples, internal interconnects 222 can comprise gold, aluminum, orcopper. Electronic component 220 can be coupled to base bottom terminals270 through internal interconnects 222 and conductive structure 212 ofbase substrate 210. In some examples, electronic component 220 cancomprise or be referred to as a die, a chip, a package, a sensor, or anemitter. Electronic component 220 can have a width in the range of about100 μm to about 100 mm and a thickness in the range of about 1 μm toabout 10 mm.

Encapsulant 230 can be provided to cover electronic component 220 andtop side 210 x of base substrate 210. Encapsulant 230 can be broughtinto contact with side sides of electronic component 220 and can also bebrought into contact with terminals 221 and internal interconnects 222.Encapsulant 230 can be brought into contact with top side 210 x of basesubstrate 210. Encapsulant 230 can comprise cavity 231 exposinginterface element 223 at the top side of electronic component 220.Encapsulant 230 can be similar to encapsulant 170 with respect tocorresponding features, elements, materials, or formation. Encapsulant230 can have a thickness in the range of about 1 μm to about 1,000 μm.

Vertical interconnects 240 can be exposed at top side 230 x and bottomside 230 y of encapsulant 230 and can be coupled with conductive pads212 b of base substrate 210. In some examples, vertical interconnects240 can be similar to vias 112, 122, or 142 with respect tocorresponding features, elements, materials, or formation. In someexamples, vertical interconnects 240 can be provided usingelectroplating, electroless plating, sputtering, wirebonding, PVD, CVD,MOCVD, ALD, LPCVD, or PECVD. In some examples, vertical interconnects240 can comprise or be referred to as pillars, posts, vias, or verticalwires. Vertical interconnects 240 can have a thickness in the range ofabout 1 μm to about 10 mm and a height similar to encapsulant 230.

Base top terminals 250 can be coupled to vertical interconnects 240exposed at top side 230 x of encapsulant 230. Base top terminals 250 cancomprise or be referred to as pads, under-bump-metallurgies (UBMs), oras top sides of vertical interconnects 240. In some examples, base topterminals 250 can be similar to lens terminals 113 or 114 or spacerterminals 123 or 124 with respect to corresponding features, elements,materials, or formation.

Lid 260 can be bonded adjacent to top side 230 x of encapsulant 230using a lid seal or adhesive. In some examples, encapsulant 230 cancomprise a ledge into top side 230 x, and the ledge can support theperimeter of lid 260. In some examples, the bottom side of lid 260 canextend lower than top side 230 x of encapsulant 230. Lid 260 can beplaced by pick-and-place equipment on encapsulant 230, where interfaceelement 223 of electronic component 220 can be positioned under lid 260.Lid 260 can be separated from interface element 223 of electroniccomponent 220 by encapsulant 230. In some examples, lid 260 can compriseor be referred to as a translucent, whether fully or partiallytransparent, permeable, or glass material. Lid 260 can have a thicknessin the range of about 1 μm to about 10 mm.

Base bottom terminals 270 can be coupled to conductive pads 212 c ofbase substrate 210. Base bottom terminals 270 can be coupled toelectronic component 220 through base substrate 210 and internalinterconnects 222. In some examples, base bottom terminals 270 can besimilar to interconnects 115 with respect to corresponding features,elements, materials, or formation. In some examples, base bottomterminals 270 can be referred to as external input/output terminals ofsemiconductor device 1000.

FIG. 2M shows a cross-sectional view of semiconductor device 1000 at alater stage of manufacture. In the example shown in FIG. 2M, underfill180 can be provided between base unit 200 and lens unit 100, for examplebetween base unit 200 and lens substrate 110. In some examples,underfill 180 can be injected or absorbed into a gap between top side ofbase unit 200 and bottom side of lens unit 100, and then be cured.Underfill 180 can be positioned between top side 230 x of encapsulant230 of base unit 200 and bottom side 110 y of lens substrate 110. Insome examples, underfill 180 can define a cavity, aligned with lens 110a and interface element 223, between lid 260 and lens substrate 110.Underfill 180 is shown extending to contact a perimeter of lid 260, butin some examples underfill 180 need not extend to reach lid 260. Abottom side of lens 110 a of lens substrate 110 and the top side of lid260 can face each other. Underfill 180 can prevent lens unit 100 frombeing electrically disconnected from base unit 200 due to physical orchemical shocks. In some examples, underfill 180 can be similar tounderfill 127.

In some examples, lens substrate 150 can be over spacer substrate 140,spacer substrate 140 can be over lens substrate 130, lens substrate 130can be over spacer substrate 120, and spacer substrate 120 can be overlens substrate 110, to provide lens 151 a over lens 131 a, and lens 131a over lens 111 a. Lens 111 a can be over or aligned with interfaceelement 223 of electronic component 220. In some examples, lenses 111 a,131 a, or 151 a can be aligned with each other and can also be alignedwith interface element 223 of electronic component 220.

FIG. 3 shows a cross-sectional view of an example semiconductor device2000. In the example shown in FIG. 3, semiconductor device 2000 cancomprise lens unit 300 and base unit 200. Lens unit 300 can compriselens substrates 110, 330, or 350, spacer substrates 120 or 140, lensprotector 160, encapsulant 170, and underfill 180. Lens substrates 330or 350 can comprise dielectrics 331 or 351, vias 132 or 152, lens topterminals 133 or 153, lens bottom terminals 134 or 154, or interconnects135 or 155. Dielectrics 331 or 351 can comprise or be coupled to lenses331 a or 351 a.

Semiconductor device 2000 can be similar to semiconductor device 1000with respect to corresponding features, elements, materials, orformation. For example, lens unit 300 can be similarly to lens unit 100as described in FIGS. 2A to 2K and can comprises lenses 331 a or 351 aof lens unit 300.

Lenses 111 a, 331 a, and 351 a are exemplary lenses illustrated tohighlight that different lenses of lens unit 300, like those of lensunit 100, can have different optical characteristics. For example, lens331 a of lens unit 300 can have a smaller width than lens 111 a. Lens131 a can be a convex lens shaped to protrude from lens substrate 110,and lens 331 a can be a concave lens shaped to be recessed into lenssubstrate 330. Lens 531 a can have a smaller width than lens 331 a.Lenses 111 a, 331 a, and 531 a of such lens unit 300 can have widths andshapes varied in various manners.

The present disclosure includes reference to certain examples. It willbe understood by those skilled in the art, however, that various changesmay be made, and equivalents may be substituted without departing fromthe scope of the disclosure. In addition, modifications may be made tothe disclosed examples without departing from the scope of the presentdisclosure. Therefore, it is intended that the present disclosure is notlimited to the examples disclosed, but that the disclosure will includeall examples falling within the scope of the appended claims.

1. A semiconductor device, comprising: a spacer substrate comprising, aspacer dielectric; a spacer top terminal on a top side of the spacersubstrate; a spacer bottom terminal on a bottom side of the spacersubstrate; and a spacer via in the spacer dielectric and coupled withthe spacer top terminal and the spacer bottom terminal; a first lenssubstrate over the first spacer substrate, the first lens substratecomprising, a first lens dielectric; a first lens; a first lens topterminal on a top side of the first lens dielectric; a first lens bottomterminal on a bottom side of the first lens dielectric; and a first lensvia in in the first lens dielectric and coupled with the first lens topterminal and the first lens bottom terminal; a lens protector over thefirst lens dielectric adjacent to the first lens; and a firstinterconnect coupled with the spacer top terminal and the first lensbottom terminal.
 2. The semiconductor device of claim 1, wherein thefirst lens and the first lens dielectric comprise a same material. 3.The semiconductor device of claim 1, wherein the first lens and thefirst lens dielectric comprise a different material.
 4. Thesemiconductor device of claim 1, further comprising an encapsulantcontacting a lateral side of the first lens substrate, and a dielectricwall of the spacer substrate.
 5. The semiconductor device of claim 1,further comprising: a second lens substrate, wherein the spacersubstrate is over the second lens substrate, the second lens substratecomprising: a second lens dielectric; a second lens over the second lensdielectric; a second lens top terminal on a top side of the second lensdielectric; a second lens bottom terminal on a bottom side of the secondlens dielectric; and a second lens via in in the second lens dielectricand coupled with the second lens top terminal and the second lens bottomterminal; and a second interconnect coupled with the second lens topterminal and the substrate bottom terminal.
 6. The semiconductor deviceof claim 1, further comprising: a base substrate, wherein the first lenssubstrate is over the base substrate, the base substrate comprising: adielectric structure; a conductive structure in the dielectricstructure; and an electronic component over the dielectric structure,wherein the electronic component is electrically coupled with theconductive structure.
 7. The semiconductor device of claim 6, furthercomprising: a base encapsulant over the dielectric structure andcontacting a lateral side of the electronic component; an encapsulanttop terminal on a top side of the encapsulant; and an encapsulant via inthe encapsulant coupled with the encapsulant top terminal; and a secondinterconnect coupled with the spacer bottom terminal and the encapsulanttop terminal.
 8. The semiconductor device of claim 6, further comprisinga lid over the electronic component between the electronic component andthe first lens.
 9. A semiconductor device, comprising: a first lenssubstrate, comprising: a first lens dielectric; a first lens over thefirst lens dielectric; and a lens top terminal on a top side of thefirst lens dielectric; a spacer substrate over the first lens substrate,the spacer substrate comprising: a spacer dielectric; a spacer topterminal; and a spacer bottom terminal; a second lens substrate over thespacer substrate, the second lens substrate comprising: a second lensdielectric; a second lens over the second lens dielectric; and a lensbottom terminal on a bottom side of the second lens dielectric; a firstinterconnect coupled with the lens top terminal and the spacer bottomterminal; and a second interconnect coupled with the spacer top terminaland the lens bottom terminal; wherein the first lens has a first opticalcharacteristic and the second lens has a second optical characteristicdifferent than the first optical characteristic.
 10. The semiconductordevice of claim 9, further comprising an encapsulant contacting alateral side of the first lens substrate, a lateral side of the secondlens substrate, and a dielectric wall of the spacer substrate.
 11. Thesemiconductor device of claim 9, further comprising a lens protector ona top side of the second lens substrate and adjacent to the second lens.12. The semiconductor device of claim 11, further comprising anencapsulant contacting a top side of the lens protector.
 13. Thesemiconductor device of claim 9, further comprising: a base unit,wherein the first lens substrate is over the base unit, the base unitcomprising a base top terminal on a top side of the base unit; and athird interconnect coupled with the base top terminal and a first lenssubstrate bottom terminal on a bottom side of the first lens dielectric.14. The semiconductor device of claim 13, wherein the base unitcomprises a redistribution layer (RDL) substrate.
 15. The semiconductordevice of claim 13, wherein the base unit comprises a pre-formedsubstrate.
 16. The semiconductor device of claim 13, further comprisingan underfill between the base unit and the first lens substrate.
 17. Amethod to manufacture a semiconductor device, comprising: providing afirst lens substrate having a first lens; providing a first spacersubstrate facing the first lens substrate; and coupling the first lenssubstrate and the first spacer substrate with a first interconnect;wherein: the first lens substrate comprises a first lens via and a firstlens terminal coupled to the first lens via; the first spacer substratecomprises a first spacer via and a first spacer terminal coupled to thefirst spacer via; and the first interconnect couples the first lensterminal with the first spacer terminal.
 18. The method of claim 18,further comprising providing an encapsulant over a lateral side of thefirst lens substrate and over a dielectric wall of the first spacersubstrate.
 19. The method of claim 18, further comprising: providing abase unit having an electronic component; coupling the base unit and thefirst lens substrate with a base interconnect; wherein the coupling withthe base interconnect aligns the electronic component with the firstlens.
 20. The method of claim 19, further comprising: providing anunderfill between the base unit and the first lens substrate.